3D Technology
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Integrated Measurement System
3D Technology
LWSI
Large FOV White light Scanning Interferometer
General WSI
(White Light Scanning interferometer)
Large FOV
High Speed Camera &
High Speed Image processing module
Special Illumination Technique
- INTEKPLUS的LWSI
- 为将WSI光学器的3D测量精度应用于High-End产品的量产工序，开发出了改善WSI光学界的LWSI光学器。 通过高分辨率Camera、特殊的Beam splitter和照明，专用 Image Processing模组，完成了高检测性能及增加生产率的系统。
Slit Beam Scanning
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Single Camera
Slit Beam Scanning (General Type)
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Dual Camera
Slit Beam Scanning (INTEKPLUS Patent)INTEKPLUS拥有专利的 Dual Slit Beam Metrology，可无隐藏区域的测定所有检查区域的True 3D
Application of Slit Beam
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Semiconductor PKG
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Semiconductor PKG
Phase Measuring Profilometry
Phase Measuring Profilometry (Moire)
搭载加强算法的INTEKPLUS进化技术Phase Measurement Profilometry可精密检测车身表面等宽区域的细微瑕疵。
Basic concept of PMP
Application of PMP
Stereo Camera
Triangulation - 3D
Triangulation - 3D
Stereo Camera Triangulation Metrology
INTEKPLUS的Stereo Camera Triangulation Metrology与Real Time image Processing技术及加强算法相结合， 可实时测定True 3D ，并不受对象物的反射度及颜色影响。
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Real 3D Image + Z map
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Z map
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Real 3D Image + Z map
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Z map
